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| Title | Size | Download |
|---|---|---|
| 02-Appendix | 75.25 KB |
Appendix A Specifications and support information
Operating temperature requirements
Obtaining the most recent firmware or software
Appendix A Specifications and support information
Component specifications
For components compatible with the server and detailed component information, use the component compatibility lookup tool at http://www.h3c.com/en/home/qr/default.htm?id=66.
Operating temperature requirements
Table 1 Operating temperature requirements on the server
|
Drive configuration |
Max. temperature |
||
|
30°C (86°F) |
35°C (86°F) |
40°C (86°F) |
|
|
3SFF model with drive configurations |
All configurations are supported. |
· Processors with a TDP of 225W or higher are not supported. · All fan modules must operate correctly. |
· DDR5 DIMMs of 64G are not supported. · Processors with a TDP of 225W or higher are not supported. · Mezz cards are not supported. · All fan modules must operate correctly. |
|
Dual-network adapter model with drive configurations |
All configurations are supported. |
· Processors with a TDP of 225W or higher are not supported. · All fan modules must operate correctly. |
· DDR5 DIMMs of 64G are not supported. · Processors with a TDP of 225W or higher are not supported. · Mezz cards are not supported. · All fan modules must operate correctly. |
|
When a fan module fails or a single rotor of a dual-rotor fan module fails, the maximum server operating temperature decreases by 8°C (46.4°F) and the performance of GPUs and processors that support throttling might decrease. |
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Technical support
To resolve issues during routine maintenance or troubleshooting, contact Technical Support.
Obtaining the most recent firmware or software
To obtain the most recent firmware or software, access https://www.h3c.com/en/BizPortal/DownLoadAccessory/en_DownLoadAccessoryFilt.aspx.
Collecting information
To facilitate troubleshooting, collect the following server information before contacting Technical Support:
· Log and sensor information.
· Product serial number.
· Product model and name.
· Screenshots of error messages and descriptions.
· Hardware change records, including installation, replacement, insertion, and removal of hardware components.
· Third-party software.
· Operating system type and version.
Preparing maintenance tools
To facilitate troubleshooting, prepare the following tools:
· T-25 Torx screwdriver.
· T-15 Torx screwdriver.
· Monitor (such as PC).
· ESD wrist strap, antistatic gloves, and antistatic clothing.
For more information about these tools, see "Installation tools."
Product security and compatibility
For information about the product security and compatibility, see the security and compatibility manual for the server.
Product recycling
New H3C Technologies Co., Ltd. provides product recycling services for its customers to ensure that hardware at the end of its life is recycled. Vendors with product recycling qualification are contracted to New H3C to process the recycled hardware in an environmentally responsible way.
For product recycling services, contact New H3C at
· Tel: 400-810-0504
· E-mail: [email protected]
· Website: http://www.h3c.com
Glossary
|
Description |
|
|
B |
|
|
BIOS |
The Basic Input Output System (BIOS) is a collection of programs stored on a ROM chip on the server motherboard. It includes critical components such as the Basic Input Output Program, Power-On Self-Test (POST), and system startup programs. The BIOS provides the most fundamental and direct hardware settings and controls for the computer. |
|
G |
|
|
GPU |
A GPU is one of the most important components of a server. It is used to convert digital signals from the server into analog signals, which are then displayed on a monitor. Additionally, a GPU has image processing capabilities and can assist CPUs in tasks, thereby enhancing the overall operational speed of the server. |
|
H |
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HDM |
Hardware Device Management (HDM) is a control unit used for server management. Through HDM, you can simplify the server configuration process, view server component information, monitor server operation status, and remotely control the server, among other functions. |
|
Hot swapping |
Hot swapping capability refers to the ability to remove or install a component in a server while the server is running, without the need to power down the server. This operation does not disrupt the running system and avoids any impact on its operation. |
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K |
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KVM device |
A Keyboard, Video, Mouse (KVM) device is a physical device that allows you to monitor and manage multiple servers using a single set of keyboard, display, and mouse. |
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N |
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Network adapter |
A network adapter is a network component that operates at the data link layer. It not only establishes a physical connection and electrical signal matching between the LAN transmission media but also provides functions such as frame transmission and reception, frame encapsulation and decapsulation, medium access control, data encoding and decoding, and data caching. |
|
NVMe VROC module |
An NVMe VROC module is used to activate the RAID features of NVMe SSDs. It works in conjunction with the VMD technology to enable NVMe drive array functionality. |
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R |
|
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RAID |
Redundant Array of Independent Disks (RAID) is a technology used for combining multiple independent physical drives in different ways to create a disk array, providing higher storage performance and data security than a single drive. |
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Redundancy |
Redundancy means that when a component, such as a fan, fails, the system can automatically utilize a backup component to replace the failed one. |
Acronyms
|
Acronym |
Full name |
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B |
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BIOS |
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C |
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CPU |
Central Processing Unit |
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D |
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DDR |
Double Data Rate |
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DIMM |
Dual In-Line Memory Module |
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DRAM |
Dynamic Random Access Memory |
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G |
|
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GPU |
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H |
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HBA |
Host Bus Adapter |
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HDD |
Hard Disk Drive |
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HDM |
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I |
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ICM |
Interconnect Module |
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L |
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LFF |
Large Form Factor |
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LRDIMM |
Load Reduced Dual Inline Memory Module |
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N |
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NVMe |
Non-Volatile Memory Express |
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O |
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OM |
Onboard Management |
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P |
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PCIe |
Peripheral Component Interconnect Express |
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R |
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RAID |
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RDIMM |
Registered Dual Inline Memory Module |
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S |
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SAS |
Serial Attached Small Computer System Interface |
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SATA |
Serial ATA |
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SFF |
Small Form Factor |
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SSD |
Solid State Drive |
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SST |
Speed Select Technology |
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T |
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TCM |
Trusted Cryptography Module |
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TDP |
Thermal Design Power |
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TPM |
Trusted Platform Module |
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U |
|
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UID |
Unit Identification |
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UPI |
Ultra Path Interconnect |
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USB |
Universal Serial Bus |
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V |
|
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VROC |
Virtual RAID on CPU |
|
VMD |
Volume Management Device |
