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02-Appendix | 69.37 KB |
Appendix A Part specifications
Query all the parts supported by the server and their details through the official website Server-compatible Part Query Tool.
Operating ambient temperature specification
Table 1 Operating ambient temperature specification
Temperature CPU mode |
Maximum temperature |
|||
35°C |
40°C |
45°C |
||
Common mode |
The CPU with 165 W ≤ TDP ≤ 235 W is supported, and: · When the PCIe card of the front panel outlet port is configured, only the CPU models 6314U, 6330, 6330N, 6338N, and 8351N are supported When CPU models 6348 and 6354 are configured, the maximum operating temperature drops to about 30°C if a single fan fails |
The CPU with TDP ≤ 225 W is supported, where the CPU models 6346, 6354, 8352S, and 8352Y are not supported, and: · When the PCIe card of the front panel outlet port is configured, only the CPU models 6314U and 6330N are supported · The PMem 200 DIMM is not supported When the CPU models 6338, 6346, and 8352V are configured, the maximum operating temperature drops to about 35°C if a single fan fails |
The CPU models 6314U, 6330N, 6338N, and 8351N are supported, and: · When the PCIe card of the front panel outlet port is configured, only the CPU models 6314U and 6330N are supported · When CPU models 6338N and 8351N are configured, the maximum operating temperature drops to about 40°C if a single fan fails · The NVMe drive is not supported · The SATA M.2 SSD module is not supported The PMem 200 DIMM is not supported |
|
SST mode |
The CPU with TDP ≤ 225 W is supported, where the CPU models 6354, 8352S, and 8352Y are not supported, and: When the PCIe card of the front panel outlet port is configured, only the CPU models 6314U, 6330N, and 6338N are supported |
· The CPU models 6314U, 6330N, 6338N, and 8351N are supported, and: · When the PCIe card at the front panel outlet port is configured, only the 6330N CPU is supported. When a single fan fails, the maximum operating temperature drops to about 35°C · When CPU model 8351N is configured, the maximum operating temperature drops to about 35°C if a single fan fails · The PMem 200 DIMM is not supported |
The CPU model 6330N is supported, and: · The PCIe card at the front panel outlet port is not supported, e.g., the PCIe network card · The NVMe drive is not supported · The SATA M.2 SSD module is not supported · The PMem 200 DIMM is not supported The maximum operating temperature drops to about 40°C if a single fan fails |
Appendix B Technical support
If you encounter any complicated problems during daily maintenance or troubleshooting, contact H3C Support.
Collecting server information
Before contacting H3C Support, collect the following server information to facilitate troubleshooting:
· Log and sensor information.
· Product serial number.
· Product model and name.
· Snapshots of error messages and descriptions.
· Hardware change history, including installation, replacement, insertion, and removal of hardware.
· Third-party software installed on the server.
· Operating system type and version.
Preparing debugging tools
Prepare the following possible tools to facilitate troubleshooting:
· T-25 Torx star screwdriver: Used to remove and install the radiator
· T-15 Torx star screwdriver: Used to replace the main board
· Display terminal (such as PC)
· ESD wrist strap/ESD gloves/ESD clothing
Appendix C Product recycling
New H3C Technologies Co., Ltd. provides product recycling services for its customers to ensure that hardware at the end of its life is recycled. Vendors with product recycling qualification are contracted to New H3C to process the recycled hardware in an environmentally responsible way.
For product recycling services, contact New H3C at
· Tel: 400-810-0504
· E-mail: [email protected]
· Website: http://www.h3c.com
Appendix D Glossary
Table 2 Glossary
Description |
|
B |
|
BIOS |
Basic input/output system is non-volatile firmware pre-installed in a ROM chip on a server's management module. The BIOS stores basic input/output, power-on self-test, and auto startup programs to provide the most basic hardware initialization, setup and control functionality. |
G |
|
GPU card |
Graphics processing unit module converts digital signals to analog signals for output to a display device and assists processors with image processing to improve overall system performance. |
H |
|
HDM |
Hardware Device Management is the server management control unit with which administrators can configure server settings, view component information, monitor server health status, and remotely manage the server. |
K |
|
KVM device |
KVM is a management method that allows remote users to use their local video display, keyboard, and mouse to monitor and control the server. |
N |
|
NVMe VROCmodule |
A module that works with Intel VMD to provide RAID capability for the server to virtualize storage resources of NVMe drives. |
R |
|
RAID |
Redundant array of independent disks (RAID) is a data storage virtualization technology that combines multiple physical hard drives into a single logical unit to improve storage and security performance. |
Hot swapping |
A module that supports hot swapping (a hot-swappable module) can be installed or removed while the server is running without affecting the system operation. |
Redundancy |
A mechanism that ensures high availability and business continuity by providing backup modules. In redundancy mode, a backup or standby module takes over when the primary module fails. |
W |
|
Network card |
The network card is a network part operating on the data link layer. It not only realizes the physical connection and electrical signal matching with the LAN transmission media, but also provides the functions of frame sending and receiving, frame encapsulation and decapsulation, media access control, data encoding and decoding, and data caching. |
Appendix E Acronyms
Table 3 Acronyms
Acronym |
Full name |
B |
|
BIOS |
Basic Input Output System |
C |
|
CPU |
Central Processing Unit |
D |
|
DDR |
Double Data Rate |
DIMM |
Dual Inline Memory Module |
DRAM |
Dynamic Random Access Memory |
G |
|
GPU |
Graphics Processing Unit |
H |
|
HBA |
Host Bus Adapter |
HDD |
Hard Disk Drive |
HDM |
Hardware Device Management |
I |
|
ICM |
Interconnect Module |
L |
|
LFF |
Large Form Factor |
LRDIMM |
Load Reduced Dual Inline Memory Module |
N |
|
NVMe |
Non-Volatile Memory Express |
O |
|
OM |
Onboard Management |
P |
|
PCIe |
Peripheral Component Interconnect Express |
R |
|
Redundant Arrays of Independent Disks |
|
RDIMM |
Registered Dual Inline Memory Module |
S |
|
SAS |
Serial Attached Small Computer System Interface |
SATA |
Serial ATA |
SFF |
Small Form Factor |
SSD |
Solid State Drive |
SST |
Speed Select Technology |
T |
|
TCM |
Trusted Cryptography Module |
TDP |
Thermal Design Power |
TPM |
Trusted Platform Module |
U |
|
UID |
Unit Identification |
UPI |
Ultra Path Interconnect |
USB |
Universal Serial Bus |
V |
|
VROC |
Virtual RAID on CPU |
VMD |
Volume Management Device |