H3C UniServer B5700 G5 Blade Server User Guide-6W100

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02-Appendix
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Appendix A  Part specifications

Query all the parts supported by the server and their details through the official website Server-compatible Part Query Tool.

Operating ambient temperature specification

Table 1 Operating ambient temperature specification

Temperature

CPU mode

Maximum temperature

35°C

40°C

45°C

Common mode

The CPU with 165 W ≤ TDP ≤ 235 W is supported, and:

·     When the PCIe card of the front panel outlet port is configured, only the CPU models 6314U, 6330, 6330N, 6338N, and 8351N are supported

When CPU models 6348 and 6354 are configured, the maximum operating temperature drops to about 30°C if a single fan fails

The CPU with TDP ≤ 225 W is supported, where the CPU models 6346, 6354, 8352S, and 8352Y are not supported, and:

·     When the PCIe card of the front panel outlet port is configured, only the CPU models 6314U and 6330N are supported

·     The PMem 200 DIMM is not supported

When the CPU models 6338, 6346, and 8352V are configured, the maximum operating temperature drops to about 35°C if a single fan fails

The CPU models 6314U, 6330N, 6338N, and 8351N are supported, and:

·     When the PCIe card of the front panel outlet port is configured, only the CPU models 6314U and 6330N are supported

·     When CPU models 6338N and 8351N are configured, the maximum operating temperature drops to about 40°C if a single fan fails

·     The NVMe drive is not supported

·     The SATA M.2 SSD module is not supported

The PMem 200 DIMM is not supported

SST mode

The CPU with TDP ≤ 225 W is supported, where the CPU models 6354, 8352S, and 8352Y are not supported, and:

When the PCIe card of the front panel outlet port is configured, only the CPU models 6314U, 6330N, and 6338N are supported

·     The CPU models 6314U, 6330N, 6338N, and 8351N are supported, and:

·     When the PCIe card at the front panel outlet port is configured, only the 6330N CPU is supported. When a single fan fails, the maximum operating temperature drops to about 35°C

·     When CPU model 8351N is configured, the maximum operating temperature drops to about 35°C if a single fan fails

·     The PMem 200 DIMM is not supported

The CPU model 6330N is supported, and:

·     The PCIe card at the front panel outlet port is not supported, e.g., the PCIe network card

·     The NVMe drive is not supported

·     The SATA M.2 SSD module is not supported

·     The PMem 200 DIMM is not supported

The maximum operating temperature drops to about 40°C if a single fan fails

Appendix B  Technical support

If you encounter any complicated problems during daily maintenance or troubleshooting, contact H3C Support.

Collecting server information

Before contacting H3C Support, collect the following server information to facilitate troubleshooting:

·     Log and sensor information.

·     Product serial number.

·     Product model and name.

·     Snapshots of error messages and descriptions.

·     Hardware change history, including installation, replacement, insertion, and removal of hardware.

·     Third-party software installed on the server.

·     Operating system type and version.

Preparing debugging tools

Prepare the following possible tools to facilitate troubleshooting:

·     T-25 Torx star screwdriver: Used to remove and install the radiator

·     T-15 Torx star screwdriver: Used to replace the main board

·     Display terminal (such as PC)

·     ESD wrist strap/ESD gloves/ESD clothing

Appendix C  Product recycling

New H3C Technologies Co., Ltd. provides product recycling services for its customers to ensure that hardware at the end of its life is recycled. Vendors with product recycling qualification are contracted to New H3C to process the recycled hardware in an environmentally responsible way.

For product recycling services, contact New H3C at

·     Tel: 400-810-0504

·     E-mail: [email protected]

·     Website: http://www.h3c.com

Appendix D  Glossary

Table 2 Glossary

Item

Description

B

BIOS

Basic input/output system is non-volatile firmware pre-installed in a ROM chip on a server's management module. The BIOS stores basic input/output, power-on self-test, and auto startup programs to provide the most basic hardware initialization, setup and control functionality.

G

GPU card

Graphics processing unit module converts digital signals to analog signals for output to a display device and assists processors with image processing to improve overall system performance.

H

HDM

Hardware Device Management is the server management control unit with which administrators can configure server settings, view component information, monitor server health status, and remotely manage the server.

K

KVM device

KVM is a management method that allows remote users to use their local video display, keyboard, and mouse to monitor and control the server.

N

NVMe VROCmodule

A module that works with Intel VMD to provide RAID capability for the server to virtualize storage resources of NVMe drives.

R

RAID

Redundant array of independent disks (RAID) is a data storage virtualization technology that combines multiple physical hard drives into a single logical unit to improve storage and security performance.

Hot swapping

A module that supports hot swapping (a hot-swappable module) can be installed or removed while the server is running without affecting the system operation.

Redundancy

A mechanism that ensures high availability and business continuity by providing backup modules. In redundancy mode, a backup or standby module takes over when the primary module fails.

W

Network card

The network card is a network part operating on the data link layer. It not only realizes the physical connection and electrical signal matching with the LAN transmission media, but also provides the functions of frame sending and receiving, frame encapsulation and decapsulation, media access control, data encoding and decoding, and data caching.

Appendix E  Acronyms

Table 3 Acronyms

Acronym

Full name

B

BIOS

Basic Input Output System

C

CPU

Central Processing Unit

D

DDR

Double Data Rate

DIMM

Dual Inline Memory Module

DRAM

Dynamic Random Access Memory

G

GPU

Graphics Processing Unit

H

HBA

Host Bus Adapter

HDD

Hard Disk Drive

HDM

Hardware Device Management

I

ICM

Interconnect Module

L

LFF

Large Form Factor

LRDIMM

Load Reduced Dual Inline Memory Module

N

NVMe

Non-Volatile Memory Express

O

OM

Onboard Management

P

PCIe

Peripheral Component Interconnect Express

R

RAID

Redundant Arrays of Independent Disks

RDIMM

Registered Dual Inline Memory Module

S

SAS

Serial Attached Small Computer System Interface

SATA

Serial ATA

SFF

Small Form Factor

SSD

Solid State Drive

SST

Speed Select Technology

T

TCM

Trusted Cryptography Module

TDP

Thermal Design Power

TPM

Trusted Platform Module

U

UID

Unit Identification

UPI

Ultra Path Interconnect

USB

Universal Serial Bus

V

VROC

Virtual RAID on CPU

VMD

Volume Management Device

 

 

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