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Title | Size | Download |
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02-Appendix A Specifications and Support Information | 90.69 KB |
Appendix A Specifications and support information
Operating temperature requirements
Obtaining the most recent firmware or software
Appendix A Specifications and support information
Component specifications
For components compatible with the server and detailed component information, use the component compatibility lookup tool at http://www.h3c.com/en/home/qr/default.htm?id=66.
Operating temperature requirements
The cooling capability of the server depends on the power density of devices within the cabinet, the cooling capability of the cabinet, and the spacing between the server and other devices.
Table 1 shows the operating temperature requirements on the server.
Table 1 Operating temperature requirements
Drive configuration |
Max. temperature |
||
30°C (86°F) |
35°C (86°F) |
40°C (86°F) |
|
· 8SFF+60LFF |
· The processors with a TDP of 385W are not supported · The 6458Q or 8470Q processors are not supported |
· Baidu DPU2.0 smart network adapters are not supported · The processors with a TDP of 385W are not supported · The 6458Q or 8470Q processors are not supported |
· Rear drives, including PCIe M.2 expander modules are not supported. M.2 drives are not supported at the server rear · The supercapacitor is not supported at the server rear · OCP network adapters of 25G or higher are not supported · Processors with a TDP of more than 185W are not supported · Biadu DPU2.0 smart network adapters are not supported · The processors with a TDP of 385W are not supported · The 6458Q or 8470Q processors are not supported |
· When the server is stacked with other devices, the cooling capability of the server depends on the power density of devices within the cabinet and the cooling capability of the cabinet. The maximum operating temperature of the server might decrease. · The maximum operating temperature decreases by 5°C (41°F) in a stacking environment if the maximum operating temperature is declared equal to or greater than 35°C (86°F) for the server. · When a fan module fails or a single rotor of a dual-rotor fan module fails, the maximum server operating temperature decreases by 5°C (41°F) and the maximum operating temperature cannot exceed 35°C (86°F). In addition, the performance of processors with a TDP of more than 165 W might decrease. · Table 1 does not list temperature requirements on GPUs, because no GPUs are installed on the server. |
Technical support
To resolve issues during routine maintenance or troubleshooting, contact Technical Support.
Collecting information
To facilitate troubleshooting, collect the following server information before contacting Technical Support:
· Log information and sensor information.
¡ Log information includes the following:
- Event log, operation log, and SDS log on HDM.
- Diagnosis information in iFIST.
¡ Sensor information on HDM.
· Product serial number.
· Product model and name.
· Error information screenshots and description.
· Hardware change records, including adding, replacing, or re-installing hardware components.
· Third-party software.
· Operating system type and version.
Preparing maintenance tools
To facilitate troubleshooting, prepare the following tools:
· T-25, T-15, and T-10 Torx screwdrivers.
· T-30 Torx screwdriver.
· Flat-head screwdriver and Phillips screwdriver.
· Cage nut insertion/extraction tool.
· Diagonal pliers.
· Multimeter.
· Interface cable (such as an Ethernet cable or optical fiber).
· Monitor (such as PC).
· ESD wrist strap, antistatic gloves, and antistatic clothing.
For more information about these tools, see "Installation tools."
Obtaining the most recent firmware or software
To obtain the most recent firmware or software, access https://www.h3c.com/en/BizPortal/DownLoadAccessory/en_DownLoadAccessoryFilt.aspx.
Product security and compatibility
For information about the product security and compatibility, see the security and compatibility manual for the server.
Product recycling
New H3C Technologies Co., Ltd. provides product recycling services for its customers to ensure that hardware at the end of its life is recycled. Vendors with product recycling qualification are contracted to New H3C to process the recycled hardware in an environmentally responsible way.
For product recycling services, contact New H3C at
· Tel: 400-810-0504
· E-mail: [email protected]
· Website: http://www.h3c.com
Glossary
Description |
|
B |
|
BIOS |
The Basic Input Output System (BIOS) is a collection of programs stored on a ROM chip on the server motherboard. It includes critical components such as the Basic Input Output Program, Power-On Self-Test (POST), and system startup programs. The BIOS provides the most fundamental and direct hardware settings and controls for the computer. |
C |
|
CPLD |
Complex Programmable Logic Device (CPLD) is a type of digital integrated circuit that can construct logic functions according to requirements. |
G |
|
GPU |
A GPU is one of the most important components of a server. It is used to convert digital signals from the server into analog signals, which are then displayed on a monitor. Additionally, a GPU has image processing capabilities and can assist CPUs in tasks, thereby enhancing the overall operational speed of the server. |
H |
|
HDM |
Hardware Device Management (HDM) is a control unit used for server management. Through HDM, you can simplify the server configuration process, view server component information, monitor server operation status, and remotely control the server, among other functions. |
Hot swapping |
Hot swapping capability refers to the ability to remove or install a component in a server while the server is running, without the need to power down the server. This operation does not disrupt the running system and avoids any impact on its operation. |
K |
|
KVM device |
A Keyboard, Video, Mouse (KVM) device is a physical device that allows you to monitor and manage multiple servers using a single set of keyboard, display, and mouse. |
N |
|
Network adapter |
A network adapter is a network component that operates at the data link layer. It not only establishes a physical connection and electrical signal matching between the LAN transmission media but also provides functions such as frame transmission and reception, frame encapsulation and decapsulation, medium access control, data encoding and decoding, and data caching. |
NVMe VROC module |
An NVMe VROC module is used to activate the RAID features of NVMe SSDs. It works in conjunction with the VMD technology to enable NVMe drive array functionality. |
R |
|
RAID |
Redundant Array of Independent Disks (RAID) is a technology used for combining multiple independent physical drives in different ways to create a disk array, providing higher storage performance and data security than a single drive. |
Redundancy |
Redundancy means that when a component, such as a fan, fails, the system can automatically utilize a backup component to replace the failed one. |
T |
|
Temperature sensor |
A temperature sensor is used to detect the temperature at a specific location and transmits temperature information to the server system. |
U |
|
U |
A unit of measure defined as 44.45 mm (1.75 in) in IEC 60297-1. |
UniBay drive backplane |
A UniBay drive backplane is a backplane that supports SAS/SATA/NVMe drives. |
UniSystem |
UniSystem provided by H3C for easy and extensible server management. It can guide users to configure a server quickly with ease and provide an API interface to allow users to develop their own management tools. |
V |
|
VMD technology |
VMD provides hot swapping, management and fault-tolerance functions for NVMe drives to increase availability, reliability, and serviceability. |
Acronyms
Acronym |
Full name |
B |
|
BIOS |
|
C |
|
CMA |
Cable Management Arm |
CPLD |
|
CPU |
Central Processing Unit |
D |
|
DDR |
Double Data Rate |
DIMM |
Dual In-Line Memory Module |
DRAM |
Dynamic Random Access Memory |
DVD |
Digital Versatile Disc |
G |
|
GPU |
|
H |
|
HBA |
Host Bus Adapter |
HDD |
Hard Disk Drive |
HDM |
|
I |
|
IDC |
Internet Data Center |
K |
|
KVM |
Keyboard, Video, Mouse |
L |
|
LRDIMM |
Load Reduced Dual Inline Memory Module |
N |
|
NCSI |
Network Controller Sideband Interface |
NVMe |
Non-Volatile Memory Express |
P |
|
PCIe |
Peripheral Component Interconnect Express |
POST |
Power-On Self-Test |
R |
|
RAID |
|
RDIMM |
Registered Dual Inline Memory Module |
S |
|
SAS |
Serial Attached Small Computer System Interface |
SATA |
Serial ATA |
SD |
Secure Digital |
SDS |
Secure Diagnosis System |
SFF |
Small Form Factor |
sLOM |
Small form factor Local Area Network on Motherboard |
SSD |
Solid State Drive |
T |
|
TCM |
Trusted Cryptography Module |
TDP |
Thermal Design Power |
TPM |
Trusted Platform Module |
U |
|
UID |
Unit Identification |
UPI |
Ultra Path Interconnect |
UPS |
Uninterruptible Power Supply |
USB |
Universal Serial Bus |
V |
|
VROC |
Virtual RAID on CPU |
VMD |
Volume Management Device |