H3C G6 Servers Intel Platform RAS Technology White Paper-6W103

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H3C G6 Servers Intel Platform RAS

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Copyright © 2024-2025 New H3C Technologies Co., Ltd. All rights reserved.

No part of this manual may be reproduced or transmitted in any form or by any means without prior written consent of New H3C Technologies Co., Ltd.

Except for the trademarks of New H3C Technologies Co., Ltd., any trademarks that may be mentioned in this document are the property of their respective owners.

The information in this document is subject to change without notice.



Overview

The server is one of the key components of any modern data center infrastructure. It includes various components such as processors, storage devices, PCIe devices, power supplies, and fans. To ensure service stability, correct server operation based on data integrity are critical to a modern data center. In other words, we must avoid data corruption, regardless of whether data is stored on any server component (memory, cache, or processor registers) or transmitted through any platform links (Intel®UPI, PCIe, or DMI).

When a server component fails, the set of reliability, availability and serviceability (RAS) features can meet the above requirements by maximizing service availability and maintaining data integrity.

Table 1 RAS definition based on H3C G6 servers

Item

Definition

Reliability

Probability that the system produces the correct output within a given time T, as measured by the mean time between failures (MTBF) metric.

It can be enhanced by avoiding, detecting, and repairing hardware failures. A reliable system does not provide incorrect data and calculation results, but can detect and correct data corruption.

Availability

Probability of correct system running at a given time, and the percentage of the actual running time of the server to the actual running time.

Serviceability

How easy and fast the system can be repaired or maintained.

If the time for the system to repair errors increases, the serviceability decreases.

Serviceability can be improved by simplifying system issue diagnosis and providing clear and intelligent advance warnings of failures to avoid system failures.

 

Figure 1 Error categories

 

Benefits

RAS can provide the following benefits:

·     Increased system uptime—Increases system reliability for the system to stay longer, as measured by the Mean Time To Fail (MTTF), Annual Crash Rate (ACR), or Annual Service Rate (ASR) metric. A reliable system will have a longer stable running time, making it more available. H3C G6 servers, designed with high reliability in both hardware and software, can provide enterprises with longer server stability and create more value for the enterprises.

·     Reduced the duration of unexpected downtimeAdopts Intel 4th generation Xeon Scalable processors (codenamed Sapphire Rapids) and is designed to support log recording through hardware and firmware synergy. This helps identifying and isolating faults, enabling users to take preventive or proactive maintenance measures. In the event of a shutdown, the system can quickly come online, reducing maintenance costs and mitigating the impact of downtime on enterprises.

Outages are inevitable even with the best plans and processes. When an unplanned outage happens, a maintainable system can come back online quickly, as measured by the Mean Repair Time (MTTR) matric.

·     Enhanced data integrityRAS provides several mechanisms to prevent data corruption or correct corrupted data, which ensures data corruption can get contained once detected.

Applicable products

This document is applicable to the following H3C UniServer servers:

·     H3C UniServer R4300 G6

·     H3C UniServer R4700 G6

·     H3C UniServer R4900 G6

·     H3C UniServer R4900 G6 Ultra

·     H3C UniServer R4900LE G6 Ultra

·     H3C UniServer R4700LE G6

·     H3C UniServer R5300 G6

·     H3C UniServer R5500 G6

·     H3C UniServer R6700 G6

·     H3C UniServer R6900 G6

Using this document

The information in this document is subject to change over time.

The information in this document might differ from your product if it contains custom configuration options or features.

RAS system architecture

Based on MCA supported by Intel Xeon scalable processors, H3C provides a complete error management system together with hardware, the BIOS, HDM, and OS error processing mechanisms. The system can provide functions such as error diagnosis, error location, error correction, information collection, and error reporting. Since the core of the system is provided by the BIOS and HDM, it does not rely on the OS and can perform all-time detection of the system and take corresponding measures once an error occurs.

As shown in Figure 2, the error management system contains the hardware layer, CPLD, processor platform, HDM (out-of-band management), the BIOS, and OS.

·     HDMCore of the error location system. It is responsible for error information collection and analysis and can display error information as event logs or alarms from the Web interface.

·     Processor platformSupported by Intel Xeon scalable processors of the fourth generation, which compared with the previous generation provides enhanced RAS capabilities and more powerful management of errors occurred on processors, memory modules, and PCIe devices.

·     CPLDConnects downlink hardware modules, including power supplies, fans, and other underlying hardware (except processors, memory modules, drives, and standard PCIe modules), captures hardware exceptions, connects to HDM at the uplink, and transmits error information.

·     BIOSCollects and locates errors occurred on processors, memory modules, PCIe devices, and storage devices, provides error location results to HDM, and provides OS-level error management interfaces, such as APEI, to the OS.

·     UniSystemServer management software developed by H3C. It can decode SDS log messages to record hardware and software events occurred during each service cycle, including main processor, BIOS, OS, and HDM events. This helps maintenance engineers to fast locate server issues that affect server health and improve serviceability. This component is optional.

·     iFISTSingle-server management tool embedded in each server. You can use iFIST to configure RAID settings, install the OS, install drivers, and diagnose server health conditions.

·     Web interfaceWeb interface provided by management tools, such as HDM, for users to maintain the server locally or remotely. Users can use the Web interface together with LEDs of specific server components to manage the server.

·     Involved protocolsProtocols used by the error management system includes ESPI, PECI, PCIe, UART, I2C, SMBUS, and LocalBus.

Figure 2 H3C error management system architecture

 

RAS operating mechanism

H3C RAS technology is realized through the processes of error detection, reporting, and processing.

The basic error processing schemes of RAS are as follows:

·     For correctable errors, RAS marks the error location and fast repair the corresponding module. Users will not aware the occurrence of such errors.

·     For uncorrectable errors, RAS isolates the errors by isolating bad memory blocks or degrading the bus to maintain system operation. If severe errors occur and result in system outage, you must use HDM to restore or restart the system.

·     For permanent hardware failures, you must replace the faulty component or use the backup device. You can replace hot swappable components without powering off the server.

RAS technology is realized based on the following mechanisms:

·     Machine Check Architecture (MCA)

MCA reports and fixes system bus, ECC, parity, cache, and TLB errors, identifies the source of failures, and records the failure information in MC Bank. Through the MCA mechanism, both correctable and uncorrectable errors of the CPU can be reported and logged and correctable errors of hardware can be corrected. For uncorrectable errors, a hot restart is usually performed. MCA can take effect on all processors modules such as Core, Uncore, and IIO (via IOMCA) modules.

·     Integrated Error Handler (IEH)

IEH is a unified and clear-leveled error processing and reporting mechanism, including south satellite IEH, north satellite IEH, and global IEH. South satellite IEH is located in PCH, which collects and summarizes the fault information in PCH and reports the information to global IEH. North satellite IEH is located in each stack of CPU IIO, which collects and summarizes the fault information reported by all internal devices and downstream PCIe devices in the stack and reports the information to global IEH. Global IEH is located in Ubox, which summarizes the fault information reported by the downstream IEH and triggers the related interruption signal SMI/NMI or outputs ERRPIN in the range of 0 to 2.

·     IIO Advanced Error Reporting (AER)

AER detects, logs and sends signals for errors of various IIO sub-modules. AER can take effect on all IIO sub-modules such as PCIe interface, DMI, IIO core logic, and Intel VT-d modules.

Figure 3 RAS schemes

 

Error detection

As shown in Table 2, H3C G6 servers use different error detection methods for different modules to maintain high processor availability. Both error detection and correction events will be reported.

For more information about error detection methods, see "Error detection and correction (including the socket level)."

Table 2 Error detection methods for different modules

Module

Definition/Submodule

Detection method

EE

Execution engine

Residue check

IFU

Instruction fetch unit (L1 I-Cache)

Parity

DCU

Data cache unit (L1 D-cache)

Parity

I/DTLB

Instruction/Data translation look aside buffer

Parity

MLC

Mid-level cache

ECC

CHA

L3 cache: Data, tag, MESIF state

ECC

M2M

Mesh To Memory (M2M)

Parity

Punit

Power controller unit

Parity, stack overflow, time schemes

IVR

Integrated voltage regulators

Overvoltage and overcurrent

UPI

Ultra path interconnect

CRC

Rx and Tx queues

Parity

IMC

Read data buffer

Parity

Memory read write data byte enable

ECC

IIO/PCIe

Integrated I/O: Phy and link layer

CRC & ECC

Rx/Tx queues

Parity

IIO, IRP, Inter VT-d, MISC, DMA errors

Internal ring

Internal ring - data and command (DPPP, APPP)

Parity

 

Error reporting

Error reporting notifies potential faults of various types. Processor error reporting is triggered only when an error is detected. The system reports detected errors and generates error log messages.

The error reporting feature includes the following modules:

·     Machine Check Architecture (MCA)

MCA can capture and record the first error for uncorrectable errors, while for correctable errors, it records the last error. MCA can take effect on all processors modules such as Core, Uncore, and IIO (via IOMCA) modules.

·     Integrated Error Handler (IEH)

IEH provides unified error reporting. It can aggregate error information from all internal and external devices under PCH and IIO. The error information is transmitted via an internal dedicated message bus, and the global IEH device ultimately generates relevant interrupts or external signals to notify the BIOS or HDM for error handling.

·     Integrated I/O Advanced Error Reporting (IIO AER)

IIO AER is an optional extension feature of PCI Express. It provides a more powerful error reporting mechanism than the standard PCI Express error reporting mechanism, including PCI Express AER, traffic switch, IRP, IIO core, Intel VT-D, and other specific extension devices by Intel.

·     Memory correctable error reporting

This feature records the number of memory correctable errors and sends signals for memory correctable errors.

·     UPI correctable error reporting

This feature records UPI error records and send signals for UPI errors.

·     IVR error reporting

This feature provides error reporting for the voltage regulator integrated within CPUs.

Error reporting modes

The following error reporting modes are available:

·     Legacy IA-32 MCA modeSupported by several generations of Intel processors and most operating systems.

·     Corrupt Data Containment (CDC) modeAn enhancement to the MCA mechanism. When the CDC mode detects an uncorrectable error, the detection agent forwards the error data with the poison flag set to the request agent.

·     Enhanced MCA Gen2 (EMCA Gen2) modeSecond-generation enhancement to the Legacy IA-32 MCA mode. It was developed to create a mode that can be enabled in the OS and further expanded the error reporting coverage of FFM.

·     IOMCA modeAllows IIO correctable and uncorrectable fatal errors to be signaled through MCE.

·     Viral modeAdopts hardware measures to improve error tolerance. The CDC mode can tolerate data errors, but the viral mode can tolerate address, control, and other fatal errors. This prevents errors from being submitted to drives or networks.

Some of the above modes are complementary to each other and can be enabled at the same time. Table 3 describes mode compatibility.

Table 3 Error reporting mode compatibility

Mode

Legacy IA-32 MCA mode

CDC mode

EMCA Gen2 mode

IO MCA mode

Viral mode

Legacy IA-32 MCA mode

Yes

N/A

N/A

N/A

N/A

CDC mode

No

Yes

N/A

N/A

N/A

EMCA Gen2 mode

No

Yes

Yes

N/A

N/A

IO MCA mode

Yes

Yes

Yes

N/A

N/A

Viral mode

Yes

Yes

Yes

Yes

N/A

 

As shown in Table 4, the interrupt type used for error reporting depends on the error type.

Table 4 Error reporting interrupt

Error type

Interrupt type

Range

Remarks

Correctable errors

Corrected Machine Check Interrupt (CMCI)

Core/uncore

Available only in Legacy IA-32 MCA mode

Corrected SMI (CSMI)

Core/uncore

Available only in eMCA2 mode

System Management Interrupt (SMI)

Memory errors

In-band communication between all sockets through UPI bus

Message Signaled Interrupt (MSI)

PCIe errors

N/A

ERROR_N[0] pin

IIO AER and memory errors

Can be used for HDM-based RAS

Uncorrectable errors

UCNA

CMCI

Core/uncore errors at the source

Available only in Legacy IA-32 MCA mode

MSMI

Core/uncore errors at the source

Available only in eMCA2 mode

MSI and ERROR_N[1] pin

Severity 1 IIO AER nonfatal errors

N/A

SRAO and SRAR

MCERR

Core/uncore errors

Available only in Legacy IA-32 MCA mode

MSMI

Core/uncore errors at the source

Available only in eMCA2 mode

Catastrophic errors

IERR

Core/uncore errors

Available only in Legacy IA-32 MCA mode

MSMI

Core/uncore errors at the source

Available only in eMCA2 mode

 

As shown in Figure 4, the system processes errors as follows:

·     For correctable errors, when frequently occurred correctable errors reach the threshold based on the leaky bucket algorithm, the system triggers an SMI to notify the BIOS to process the errors. Upon receiving the interrupt request, the BIOS performs the following tasks while ensuring the normal operation of the system:

¡     Take the corresponding measures based on the interrupt type.

¡     Locate and isolate the failed component.

¡     Collect information about the register failure.

¡     Report error events and register information to HDM.

·     For uncorrectable errors that can be recovered, the system labels error data and triggers an SMI. Upon receiving the interrupt request, the BIOS collects information about the failed register, locates the failed component, and reports error events and register information to HDM. Such errors will not affect the operation of the system.

·     For uncorrectable errors that cannot be recovered, such errors can pull the CATERR_N pin low and causes system outage, which then will triggers HDM to collect information about the failed register in the x86 system. This ensures that users can obtain error information even if the system gets stuck.

Figure 4 Error processing

 

Error logging

The system uses MCA Bank status registers, AER status registers, memory correctable error status registers, and Intel UPI error status registers to log and record log messages for the Core, Uncore, and IIO modules.

To prevent new error logs from overwriting existing log messages, enable the FCERR mode. For more information, see "First corrected error mode."

To set the PCIe correctable error reporting thresholds, see "PCIe correctable error reporting." If the number of correctable errors reaches the threshold for both the IIO submodule and all other Uncore modules in processors, an error reporting signal is triggered. For more information, see "Threshold for correctable errors."

Table 5 Error severity and reporting methods

Error type

Range

Error logging

Corrected or advisory

non-fatal

MCA

MCA Bank registers

AER (severity 0)

PCIe error registers

IMC

CORRERRSTATUS (per rank)

Uncorrected recoverable or non-fatal

MCA

MCA Bank registers

AER (severity 1)

PCIe error registers

Uncorrected fatal

MCA

MCA Bank registers

AER (Severity 2)

PCIe error registers

Catastrophic

MCA

MCA Bank registers

 

Error processing

Memory error processing

As shown in Table 6, the memory error processing method varies by memory error type.

Table 6 Memory error processing

Error type

Possible causes

Processing method

Bit (Cell) error

High energy particle strike-soft error (SE), or transient error

SDDC, patrol scrub, and demand scrub

Persistent fault

PCLS (HBM Only)

Row error

Persistent fault

SDDC and PPR

Bank error

Persistent fault

ADDDC(SR) and ADDDC(MR)

Rank/Device error

Persistent fault

ADDDC(MR), SDDC

Addr/Cmd error

Transient/Persistent fault

DDR CMD/ADDR parity error check and retry

Multi-device error(UCE)

Persistent fault + SE

MCA-recovery and address range mirroring

Connector error

Electrical noise or transient error

Transaction retry

Wear-out or manufacturing defect or persistent fault

Memory disable/mapout for FRB

Channel failure

Board defect

 

For information about SDDC, see "DRAM single device data correction (SDDC)." SDDC corrects errors on individual DRAM devices based on error codes and requires virtual lockstep support. SDDC provides error check and correction to correct single-bit (hard errors) and multi-bit errors on individual DRAM chips on DIMMs.

For information about PCLS, see "Partial cache line sparing (PCLS, HBM only)." PCLS can correct single-bit errors. When a permanent single-bit error occurs on the cache line, a backup bit can be used to replace the error bit, which makes PCLS performance better than ADDDC(MR) and ADC(SR). A single memory channel can support a maximum of 16 sets of PCLS. PCLS is supported only on HBM.

Another key technology for memory error handling is ADDDC (MR), which also requires virtual lockstep support and supports only correctable errors. ADDDC supports only x4 DIMMs, and it can correct hard failures on up to two DIMM regions (different banks or ranks) per memory channel.

Virtual lockstep is a data error correction algorithm implemented in hardware and firmware. This algorithm enables the duplication and swapping of codewords (32 bytes, half of a cache line) between related memory regions. Based on this algorithm, it allows for the replacement of faulty memory regions (bank or rank) to complete error repair.

CPU error processing

CPU core errors are mainly processed by using the Core Disable For FRB (Fault Resilient Boot), Core DCU Scrubbing, and Corrupt Data Containment functions.

·     Core Disable For FRBAs the number of CPU cores in a server increases, a single failure point shifts from the entire processor to smaller components within processors, such as individual cores or part of the LLC. Therefore, when a CPU fails, it becomes necessary to disable a specific core or a subset of cores except for disabling the entire CPU.

·     Core DCU ScrubbingAllows the system to write the DCU data in M state to MLC and leave a data copy in E state in DCU when soft error occurs to DCU data. This write back algorithm has the minimal impact on performance and the fatal MCERR error can be transformed to a correctable error because MLC is protected by the ECC mechanism.

·     Corrupt Data Containment (CDC)

CDC is also known as data poisoning. It synchronizes uncorrectable data error messages to transactions to improve error containment and system reliability. H3C G6 servers with Intel Xeon scalable processors of the fourth generation implement CDC functionality in Core, Uncore, and IIO subsystems.

¡     CDC in the Core subsystem

When uncorrectable data errors are detected in memory, MLC, or LLC, and CDC is enabled, data is marked as poisoned and received by the Core. Then, the Core can directly drop data and triggers fatal or correctable MCERRs. If a correctable MCERR is triggered, the SW/OS/VMM layer can attempt error clearance to enhance system reliability.

¡     CDC in the Uncore subsystem

When data marked as poisoned is received by an Uncore component (such as IMC, M2M, UPI, and CHA), the Uncore does not consume the data and discards it directly. In addition, a correctable MCERR event occurs. The SW/OS/VMM layer can then attempt error clearance to enhance system reliability.

¡     CDC in the IIO subsystem

CDC is also supported by the submodules in the IIO subsystem, such as IRP, CXL, and PCIe, enhancing system reliability.

PCIe error processing

PCIe errors are mainly processed by using the PCIe Link Retraining and Recovery and PCI Express Corrup Data Containment functions.

·     PCIe Link Retraining and RecoveryAllows link rebuilding in case of link degrading on PCI Express interfaces without affecting hung processes. If link degrading occurs on a specific lane, the recovery mechanism reduces the link width (for example, from x16 to x8) based on the link degrading rules defined by Platform Design Guide (PDG). If link degrading occurs on multiple lanes, the recovery mechanism attempts to rebuild links at the next available speed.

·     PCI Express Corrup Data ContainmentAlso known as Data Poisoning. This feature allows the system to mark received uncorrectable data errors as bad data and then send the data to the destination. The destination ignores the data or saves the data with the poison bit set. The poison flag can be set by both the transmitter and receiver.

UPI error processing

UPI errors are mainly processed by using the Intel UPI Corrupt Data Containment and Intel UPI Dynamic Link Width Reduction functions.

·     Intel UPI Corrupt Data Containment—Adds a global POISON_ENABLE bit to each UPI link. The BIOS can set the enabling status of data poison by specifying a global bit through writing. With Intel UPI Date Poison enabled, UPI forwards received poison data to the destination without triggering error signal reporting or logging. It is determined by data consumers how to process uncorrectable data errors.

With UPI Data Poison disabled, UPI cannot identify poison data, and all units operate in Legacy MCA mode. Once poison data is received, Intel UPI will send an error signal and log the error.

·     Intel UPI Dynamic Link Width Reduction—Dynamically adjusts lane width to recover from hard failures occurred on one or multiple data lanes of an Intel UPI link. If possible, the link will keep operating over the narrow width. In case of a physical lane failure, width reduction from full-width to x8 is supported. Half-width support is only available for a minimal set of a x8 bits to allow for the failure of any single data lane. The supported dynamic link width reduction modes are lanes [7:0] or [23:15], which means that a multi lane failure will recover as long as not all failures are on [7:0] and [23:15].

RAS features

Hardware compatibility with RAS features

IMPORTANT

IMPORTANT:

·     Each G6 server model supports multiple processor models. For more information about compatible processors, see the appendix of the user guide for the server. RAS features marked with No for some processors in Table 7 are not available for 4XXX or 3XXX processors.

·     Only HBM processors support RAS features marked with HBM Only in Table 7.

·     R4900 in Table 7 include R4900 G6 and R4900 G6 Ultra.

 

Table 7 RAS feature and server compatibility

Type

Feature name

R4700

R4900

R5300

R5500

R6700

R6900

CPU

Error detection and correction (including the socket level)

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Corrupt data containment mode – poison mode

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Advanced error detection and correction (AEDC)

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Time-out timer schemes

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Error reporting (MCA, AER) – Core, Uncore, and IIO

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Error reporting through MCA 2.0 (EMCA Gen2)

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Processor BIST

Yes

Yes

Yes

Yes

Yes

Yes

CPU

MCA bank error control

Yes

Yes

Yes

Yes

Yes

Yes

CPU

First corrected error mode

Yes

Yes

Yes

Yes

Yes

Yes

CPU

PCIe correctable error reporting

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Threshold for correctable errors

Yes

Yes

Yes

Yes

Yes

Yes

CPU

CSR error log cloaking

Yes

Yes

Yes

Yes

Yes

Yes

CPU

DCU/IFU poison enhancements

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Core DCU scrubbing

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Core disable for FRB

Yes

Yes

Yes

Yes

Yes

Yes

CPU

Enhanced SMM (ESMM)

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Memory corrected error reporting

Yes

Yes

Yes

Yes

Yes

Yes

Memory

DRAM single device data correction (SDDC)

Yes

Yes

Yes

Yes

Yes

Yes

Memory

DDR command/address parity check and retry

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Command and address-based memory data irregular encoding

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Memory demand and patrol scrubbing

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Memory thermal throttling (memory temperature adjustment)

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Memory mirroring

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Adaptive DDDC - single region (ADDDC - SR)

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Post package repair (PPR)

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Partial cache line sparing (PCLS, HBM only)

HBM only

HBM only

HBM only

HBM only

HBM only

HBM only

Memory

HBM- bank sparing

HBM only

HBM only

HBM only

HBM only

HBM only

HBM only

Memory

Memory disable/map-out for FRB

Yes

Yes

Yes

Yes

Yes

Yes

Memory

Memory SMBus hang recovery

Yes

Yes

Yes

Yes

Yes

Yes

Memory

DDR address range/partial memory mirroring

No for some processors

No for some processors

No for some processors

No for some processors

Yes

Yes

Memory

Adaptive DDDC - multi-region(ADDDC - MR)

No for some processors

No for some processors

No for some processors

No for some processors

Yes

Yes

UPI

UPI link level retry

Yes

Yes

Yes

Yes

Yes

Yes

UPI

UPI protocol protection via CRC (16 bit)

Yes

Yes

Yes

Yes

Yes

Yes

UPI

UPI dynamic link width reduction

No for some processors

No for some processors

No for some processors

No for some processors

Yes

Yes

PCH

PCH PCIe Advanced Error Reporting (AER)

Yes

Yes

Yes

Yes

Yes

Yes

IIO

PCIe link retraining and recovery

Yes

Yes

Yes

Yes

Yes

Yes

IIO

PCIe link CRC error check and retry

Yes

Yes

Yes

Yes

Yes

Yes

IIO

PCIe corrupt data containment (data poisoning)

Yes

Yes

Yes

Yes

Yes

Yes

IIO

PCIe ECRC

Yes

Yes

Yes

Yes

Yes

Yes

IIO

PCIe enhanced downstream port containment (eDPC)

Yes

Yes

Yes

Yes

Yes

Yes

IIO

PCIe card surprise hot plug

Yes

Yes

Yes

Yes

Yes

Yes

IIO

PCIe card hot-plug (add/remove/swap)

Yes

Yes

Yes

Yes

Yes

Yes

IIO

Error reporting via IOMCA

Yes

Yes

Yes

Yes

Yes

Yes

IIO

Integrated error handler

Yes

Yes

Yes

Yes

Yes

Yes

System

Faulty DIMM isolation

Yes

Yes

Yes

Yes

Yes

Yes

System

Out-of-band error log obtaining

Yes

Yes

Yes

Yes

Yes

Yes

System

Error injection

Yes

Yes

Yes

Yes

Yes

Yes

System

Predictive failure analysis

Yes

Yes

Yes

Yes

Yes

Yes

System

Suppress inbound shutdown

Yes

Yes

Yes

Yes

Yes

Yes

System

Demoted warm reset

Yes

Yes

Yes

Yes

Yes

Yes

System

MCA 2.0 recovery

Yes

Yes

Yes

Yes

Yes

Yes

System

MCA recovery – execution path

Yes

Yes

Yes

Yes

Yes

Yes

System

MCA recovery – non-execution path

Yes

Yes

Yes

Yes

Yes

Yes

System

Local machine check exceptions (LMCE) based recovery

Yes

Yes

Yes

Yes

Yes

Yes

System

Viral mode

No for some processors

No for some processors

No for some processors

No for some processors

Yes

Yes

System

Asynchronous MCA error injection (aka MCA bank spoofing error injection)

No for some processors

No for some processors

No for some processors

No for some processors

Yes

Yes

Power supply

Hot swappable power supplies in N+N redundancy

Yes

Yes

Yes

Yes

Yes

Yes

Fan module

Hot swappable fan modules in N+1 redundancy

Yes

Yes

Yes

Yes

Yes

Yes

Network adapter

Hot swappable OCP network adapters

Yes

Yes

Yes

Yes

Yes

Yes

Drive

Hot swappable drives and RAID controllers

Yes

Yes

Yes

Yes

Yes

Yes

Drive

Drive fault location

Yes

Yes

Yes

Yes

Yes

Yes

Storage controller

Power fail safeguard

Yes (with supercapacitor installed)

Yes (with supercapacitor installed)

Yes (with supercapacitor installed)

Yes (with supercapacitor installed)

Yes (with supercapacitor installed)

Yes (with supercapacitor installed)

Storage controller

Drive fault monitoring and data recovery

Yes

Yes

Yes

Yes

Yes

Yes

Storage controller

RAID controller fault location

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Dual out-of-band management software images

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Centralized fault management system

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Location of faulty processors

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Location of faulty DIMMs

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Location of faulty PCIe devices

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Location of faulty power supplies

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Location of faulty fan modules

Yes

Yes

Yes

Yes

Yes

Yes

HDM

System board monitoring and environment information from HDM

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Remote update of system software and firmware from HDM

Yes

Yes

Yes

Yes

Yes

Yes

HDM

BSoD screenshots

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Video replay

Yes

Yes

Yes

Yes

Yes

Yes

HDM

Log download

Yes

Yes

Yes

Yes

Yes

Yes

 

RAS feature overview

Error detection and correction (including the socket level)

Feature name

Error detection and correction (including the socket level)

Description

This feature covers the error detection and correction capability at the entire processor level. It provides data protection and data integrity through enhanced cache error reporting, data path parity protection (DPPP) and address path parity protection (APPP).

Purpose

Ensure the reliability at the component level.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Corrupt data containment mode – poison mode

Feature name

Corrupt data containment mode – Poison mode

Description

The processor supports Legacy IA-32 MCA mode and MCA corrupt data containment mode

In Legacy IA-32 MCA mode, if the system detects an uncorrectable error on a module (including error-generating modules and data-transmitting modules), an MCE is directly triggered to reset the system. In corrupt data containment mode, if the system detects an uncorrectable error on a module (including error-generating modules and data-transmitting modules), an MCE will not be triggered. On the detection of an uncorrected error, the detector sets a poison bit, and the system continues data transmission with the poison bit and triggers CMCI interrupt. The receiver can perform various processing operations as needed, including ignoring errors (for example, an error of a certain pixel on the screen), discarding data, initiating retransmission, and triggering MCE.

Purpose

Improve the fault tolerance of the entire system.

Configuration

Enabled by default and can be disabled from the BIOS.

Remarks

N/A

 

Advanced error detection and correction (AEDC)

Feature name

Advanced error detection and correction (AEDC)

Description

AEDC enables fault detection by using residue checking and parity protection techniques. Fault correction is completed by instruction retry. Correctable error events are logged in IFU MCA bank. If the retry did not correct a fault, a MCERR signal is triggered.

Purpose

Improve the error coverage in the core execution engine.

Configuration

CPU built-in feature, not configurable.

Remarks

N/A

 

Time-out timer schemes

Feature name

Time-out timer schemes

Description

This feature allows timeout timers within various sub-modules to report the faults as close as possible to the fault source. The following timeout features are implemented:

·     Core 3-strike.

·     CHA TOR timeout

·     Intel UPI link level retry timeout.

·     Mesh-to-Memory (M2Mem) timeout (formerly referred to as CHA BT timeout).

·     IRP Config retry time-out.

·     PCIe Port Completion Timeout (CTO).

Purpose

Improve the server availability and serviceability.

Configuration

Enabled by default, and partially configurable.

Remarks

N/A

 

Error reporting (MCA, AER)Core, Uncore, and IIO

Feature name

Error reporting (MCA, AER)Core, Uncore, and IIO

Description

Error reporting includes logging and error signaling. Error reporting through Machine Check Architecture (MCA) and Advanced Error Reporting (AER) is mainly supported. Platform-specific memory and UPI error reporting mechanisms are also available.

Purpose

·     Report various types of errors occurring in a chassis.

·     Improve mean time to repair (MTTR).

·     Accelerate error debugging, especially in the field.

Configuration

Enabled by default and partly configurable.

Remarks

N/A

 

Error reporting through MCA 2.0 (EMCA Gen2)

Feature name

Error reporting through MCA 2.0 (EMCA Gen2)

Description

Prior to EMCA Gen2, Legacy IA-32 MCA directly reports error signals to OS/VMM, which does not utilize the UEFI firmware capability on fault diagnosis. EMCA Gen2 allows the firmware to strengthen the error logging capability of MCA.

When this feature is enabled, UEFI-FW SMI handler can read MCA bank registers and other error logging registers before the OS machine check handler reads and clears the MCA banks.

Purpose

Provide UEFI FW recovery mechanism.

Configuration

Enabled by default and configurable from the BIOS.

Remarks

N/A

 

Processor BIST

Feature name

Processor BIST

Description

BIST a self-check module inside the processor. It performs self-check on each core of the processor during the BIOS startup process and records the self-check result.

Purpose

Detect errors in the processor.

Configuration

Enabled by default and not configurable.

Remarks

N/A

 

MCA bank error control

Feature name

MCA bank error control

Description

This feature allows hiding correctable errors and UCNA errors from the operating system because these errors are already corrected by the hardware. Thus, a certain number of correctable errors can be regarded as normal actions. When this feature is enabled, only SMM and PECI can access this type of error logs.

By default, correctable errors are hided and UCNA errors can be accessed by the OS.

Purpose

Enhance server control over errors.

Configuration

Enabled by default and partly configurable.

Remarks

N/A

 

First corrected error mode

Feature name

First corrected error (FCERR) mode of error reporting

Description

This feature avoids correctable error overwriting when multiple correctable errors are reported.

In a situation where multiple correctable errors occur rapidly, hardware will not overwrite the current correctable error log until the error handling program in the firmware/software has finished processing the current error. This ensures that the error handling program in the firmware/software can reliably handle errors.

Purpose

Enhance the ability to identify faulty components that require replacement on site, improving server availability.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

PCIe correctable error reporting

Feature name

PCIe correctable error reporting

Description

You set PCIe correctable error thresholds on the root port basis and implement a better correctable error reporting system through SMI.

Purpose

Implement a better correctable error reporting architecture.

Configuration

Disabled by default and configurable.

Remarks

N/A

 

Threshold for correctable errors

Feature name

Threshold for corrected errors

Description

The processor supports error threshold functionality for all uncore MCA banks, allowing for error correction. When the threshold is reached, the corresponding MCA bank triggers a CSMI interrupt, and the FW/SW error handling program executes error processing and reporting.

Purpose

Capture threshold-based error logs for FRU isolation, PFA, and debugging when FFM is enabled.

Configuration

Enabled by default and configurable.

Remarks

N/A

 

CSR error log cloaking

Feature name

CSR error log cloaking

Description

The operating system generally does not obtain error logs from control and status registers (CSR), but some drivers might be able to access the error logs. Because these errors are already corrected by the hardware, we allow certain levels of errors to be considered normal system behavior.

This feature hides part of the CSR error log registers and prevents the operating system from processing these registers until the BIOS is ready to expose these errors.

Purpose

With BIOS-based error handling code, system developers can manage system error log capturing and reporting in absence of any interference from the error handling code in the operating system. This enhances the serviceability of the server.

Configuration

Enabled by default and configurable from the BIOS.

Remarks

N/A

 

DCU/IFU poison enhancements

Feature name

DCU/IFU poison enhancements

Description

This feature improves DCU/IFU error logging by expanding the poison storm use case of the extended DCU/IFU, reducing the probability of multiple poison errors occurring due to proximity.

Purpose

Improve the system availability.

Configuration

Enabled by default and not configurable.

Remarks

N/A

 

Core DCU scrubbing

Feature name

Core DCU scrubbing

Description

This feature enables the system to write the DCU data in M state to MLC and leave a data copy in E state in DCU when soft error occurs to DCU data. This write back algorithm has the minimal impact on performance and the fatal MCERR error can be transformed to a correctable error because MLC is protected by the ECC mechanism.

Purpose

Improve the system availability.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Core disable for FRB

Feature name

Core disable for FRB

Description

With each generation, as the number of processor cores increases, a single point of failure shifts from the entire processor to smaller entities inside the processor, such as a single core or a portion of LLC. When a failure occurs, you can disable specific cores except for disabling the entire processor.

Purpose

Improve the system reliability.

Configuration

Enabled by default and cannot be disabled.

Remarks

Make sure at least one active core is retained to complete the system boot process.

 

Enhanced SMM (ESMM)

Feature name

Enhanced SMM (ESMM)

Description

Multiple RAS features report faults through eMCA gen2, and SMM is part of eMCA gen2. This feature facilitates the SMM mode by improving the following attributes:

·     Threads in long flow/blocked indicators.

·     Target SMI.

·     SMM dump state storage into internal MSRs.

Purpose

Improve the existing SMM mode and promote the use of eMCA gen2 for error reporting.

Configuration

Enabled by default and cannot be disabled.

Remarks

This feature is available only in eMCA mode.

 

Memory corrected error reporting

Feature name

Memory corrected error reporting

Description

This feature provides correctable error counters based on leaky bucket algorithm per rank. According to the number of correctable error records in each rank, various RAS features can be activated when the correctable error threshold is reached, such as ADDDC(MR/SR), PLCS, and PPR.

Purpose

Provide correctable error counters per rank.

Configuration

Enabled by default. You can set the thresholds from the BIOS.

Remarks

N/A

 

DRAM single device data correction (SDDC)

Feature name

DRAM single device data correction (SDDC)

Description

This feature can correct multiple bit errors on 10x4 DRAM devices. SDDC error correction uses a read retry method, where each bit is individually set to the opposite value, and then the CRC calculation is performed to check for a successful match.

Purpose

Effectively handle hard failures on DRAM devices, improving the availability of the memory.

Configuration

Enabled by default and cannot be disabled.

Remarks

·     5x8 SDDC is available only when the operating mode of the memory is set to lockstep from the BIOS.

·     Though a hard failure on a DRAM device can be corrected by SDDC, the performance of the memory will degrade sharply.

 

DDR command/address parity check and retry

Feature name

DDR command/address parity check and retry

Description

The DDR5 command/address parity check and retry feature include logging of the address after command/address parity check errors and retrying the command/address. Command/address parity check errors are reported via Alert PIN and can be resolved. Although one alert signal is shared by ranks/DIMMs in one channel, which causes the IMC to fail to determine which rank/DIMM or which command triggers the alert signal, the system still locates the source of the error and attempts to restore during the error processing phase. This feature equals to memory address parity protection.

Purpose

Detect and handle errors during read, write, or various other protocol-related transmissions on the memory command/address bus to improve reliability.

Configuration

Enabled by default. You can set the thresholds from the BIOS.

Remarks

N/A

 

Command and address-based memory data irregular encoding

Feature name

Command and address-based memory data irregular encoding

Description

The memory data stream is pseudo-randomly coded through the linear shift register to balance the 0/1 distribution and reduce the probability of soft errors. In addition, the memory address double-bit error detection is realized.

Purpose

Prevent a large number of high and low voltages, reducing electrical shock and increasing reliability.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Memory demand and patrol scrubbing

Feature name

Memory demand and patrol scrubbing

Description

Demand scrubbing is the ability to write the corrected data back to the memory if a correctable error is detected on a read transaction. If an uncorrectable error is detected in the data, another read operation will be tried.

Patrol scrubbing is the ability to proactively searching system memory and attempting to correct any errors. The scrubbing and sparing (SSR) engine in the CHA reads the contents of the memory when it memory is idle according to the set frequency and step size. If a correctable error is detected in the read data, patrol scrubbing will write the corrected data back to the memory.

This feature reduces the occurrence of uncorrectable errors by read retry and correcting single-bit errors.

Purpose

Reduce the possibility of memory error occurrence.

Configuration

Disabled by default and configurable from the BIOS.

Remarks

This feature might increases power consumption.

 

Memory thermal throttling (memory temperature adjustment)

Feature name

Memory thermal throttling (memory temperature regulation)

Description

This feature adjusts memory temperature. When the temperature of the memory module reaches a threshold, the system automatically triggers performance adjustments. The memory reduces its throughput rate and increases the refresh rate to lower the temperature and maintain memory stability.

Purpose

Prevent system issues caused by overheating, enhancing system stability and reliability.

Configuration

Enabled by default.

Remarks

Memory overheating might degrade the memory performance.

 

Memory mirroring

Feature name

Memory mirroring

Description

The feature saves two copies of memory data in the primary memory and mirroring memory respectively. This can ensure that when a DIMM chip fails, the memory protection technology can use the backup mirroring memory to retrieve data automatically. Since cross mirroring between channels is used, each channel has a complete set of memory data copy, which ensures a smooth server operation.

Purpose

Avoid data loss and device shutdown caused by memory failures and improve the availability of the memory through redundancy.

Configuration

Disabled by default and can be enabled from the BIOS.

Remarks

·     Make sure the installation of DIMMs meets the requirements of memory mirroring.

·     Only 50% of the memory capacity is exposed to the operating system.

·     Memory mirroring is mutually exclusive with ADDDC.

 

Adaptive DDDC - single region (ADDDC - SR)

Feature name

Adaptive DDDC - Single Region (ADDDC - SR)

Description

In virtual lockstep mode, ADDDC(SR) can repair hard failures in individual DRAM devices. When a hard failure occurs on the bank area, it is mapped out through adaptive virtual lockstep. This is also referred to as ADC(SR).

Purpose

Repair hard failures on DRAM devices to improve the processing efficiency and reliability of hardware-level failures, enhancing system stability.

Configuration

Enabled by default and configurable from the BIOS.

Remarks

x4 DRAM memory. The failures are correctable.

 

Post package repair (PPR)

Feature name

Post package repair (PPR)

Description

DRAM devices employ row redundancy circuits to address single-row faults. A faulty row can be remapped to built-in redundant rows. Repairs are categorized as hard repair (hPPR) and soft repair (sPPR). Hard repair is a permanent fix, while soft repair is temporary and undone after a DRAM reset. During hPPR, each bank must have at least one repairable row, with the maximum number of repairable rows determined by the provider.

Purpose

DRAM units are increasingly susceptible to electrical, thermal, and mechanical stresses. PPR provides a memory repair solution to enhance the system reliability.

Configuration

Disabled by default.

Remarks

The DRAM must be larger than 4 GB.

 

Partial cache line sparing (PCLS, HBM only)

Feature name

Partial Cache Line Sparing (PCLS, HBM only)

Description

PCLS can correct single-bit errors. When a permanent single-bit error occurs on the cache line, a backup bit can be used to replace the error bit, which makes PCLS performance better than ADDDC(MR) and ADC(SR). A single memory channel can support a maximum of 16 sets of PCLS.

Purpose

Improve the system reliability.

Configuration

Enabled by default and configurable from the BIOS.

Remarks

Only available for HBM memory.

 

HBM- bank sparing

Feature name

HBM- bank sparing

Description

In the system, one bank is reserved as a spare on each HBM2e pseudo-channel. Once a fault is detected during system operation, the BIOS initiates bank sparing on the affected channel and replaces the faulty bank. This operation sets aside 1/16 of the HBM2e memory as spare memory.

Purpose

Improve the system reliability.

Configuration

Disabled by default and configurable from the BIOS.

Remarks

Only available for HBM memory.

 

Memory disable/map-out for FRB

Feature name

Memory disable/map-out for FRB

Description

During server startup, memory discovery, training, and testing are performed. If a memory is detected during this startup process, the server will disable the faulty memory (per rank, DIMM, or channel). This ensures that the server can continue with the booting process.

Purpose

Improve the system reliability.

Configuration

Enabled by default and not configurable.

Remarks

N/A

 

Memory SMBus hang recovery

Feature name

Memory SMBus hang recovery

Description

This feature enables the BIOS to perform SMBus error recovery by using SMI in runtime.

You can configure the memory controller of the server to generate an SMI on SMBus error occurrence. If the SMI occurs, the BIOS SMI handler perform the following operations:

1.     Save the TSOD address issued last time.

2.     Save the current settings of TSOD polling and error recovery.

3.     Disable both TSOD polling and error recovery.

4.     Program safe temperature.

5.     Save the current settings of closed loop thermal throttling (CLTT) and disable CLTT.

6.     Trigger the hardware timer, activate the soft reset for the SMBus, and start the periodic SMI of N ms. The value N depends on the platform.

7.     When the periodic SMI expires, identify whether the recovery is completed and disable the periodic timer. If the recovery is not completed, the periodic SMI handler will be executed again.

8.     After the SMBus recovery is completed, disable soft reset, and restore the system state saved in steps 1 to 5 above.

Purpose

Perform SMBus error recovery in runtime, improving the system availability.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

DDR address range/partial memory mirroring

Feature name

Address range/partial memory mirroring

Description

In partial mirror mode, you can set the size of mirrored memory from the BIOS. Other memory still operates in non-mirroring mode. All error detection, signaling, and correction operations in the full mirror mode can be applied to the partial mirror mode in the mirroring region.

Purpose

Save critical codes or data by using the partial mirror mode, improving memory reliability.

Configuration

Disabled by default and configurable from the BIOS.

Remarks

Memory rank sparing is mutually exclusive with memory mirroring.

 

Adaptive DDDC - multi-region(ADDDC - MR)

Feature name

Adaptive DDDC - multi-region(ADDDC - MR)

Description

In virtual lockstep mode, the ADDDC (MR) feature can repair a maximum of two hard failures on DRAM devices for different ranks and banks.

If a hard failure on a DRAM device occurs at bank/rank region granularity, it is mapped out through the adaptive virtual lockstep mode. The ADDDC(MR) feature allows a maximum of two such hard failures and is able to correct a single-bit error subsequently. ADDDC(MR) is also referred to as ADDDC(MR)+1.

Purpose

Handle hard failures on DRAM devices to improve the processing efficiency and reliability of hardware-level failures, enhancing system stability.

Configuration

Disabled by default and configurable from the BIOS.

Remarks

This feature cannot be used together with mirror mode, and supports only x4 DRAM DIMMs. This feature can be enabled on each memory channel. The failures are correctable.

 

UPI link level retry

Feature name

UPI link level retry

Description

This feature allows a link to continue the normal operation when the receiver detects a CRC error. On the detection of a CRC error, the receiver sends a retry request to the transmitter. If the CRC error occurs due to a transient event, the retry operation is expected not to experience an error. This feature allows a maximum of two retry attempts. If the error continues after two retry attempts, the physical layer will be initialized. If the error still exits after the initialization, an uncorrectable error is triggered.

Purpose

Avoid transmission errors caused by transient data errors, improving the transmission reliability of UPI links, improving system stability.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

UPI protocol protection via CRC (16 bit)

Feature name

UPI protocol protection via CRC (16 bit)

Description

This feature achieves more reliable inter-processor link communication through 16-bit CRC and improves data integrity through error detection. You can configure notifications for the system to detect CRC errors and identify potential link degradation issues that could lead to future link failures through the logs.

Purpose

Improve the system reliability.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

UPI dynamic link width reduction

Feature name

UPI dynamic link width reduction

Description

Dynamic link width reduction clears hard failure for one or multiple data channels on a physical UPI link through dynamically adjusting the link width. If the system detects persistent errors on the link, the UPI link width can be halved and the performance can also be reduced.

Purpose

Improve the uptime and reliability of the system by enabling the system to continue running even when hard failure is detected in some channels.

Configuration

Enabled by default and cannot be disabled.

Remarks

·     If the clock link fails, the UPI link width narrows by 50%.

·     After the link width is reduced, fault tolerance is not available for new failures.

·     As a best practice, arrange the maintenance when the issue is present.

 

PCH PCIe Advanced Error Reporting (AER)

Feature name

PCH PCIe Advanced Error Reporting (AER)

Description

PCIe devices integrated inside Intel chips can report faults to the CPU. The PCIe devices within Intel chips comply with the PCIe specifications.

Purpose

Report PCIe device errors within chips, improving system stability and reliability.

Configuration

The decision to report is determined by setting the corresponding mask bit.

Remarks

N/A

 

PCIe link retraining and recovery

Feature name

PCI Express link retraining and recovery

Description

This feature allows the processor to start a PCIe link retraining based on error conditions defined by PCIe specifications.

Retraining the link includes resetting the link training and status state machine (LTSSM) to the recovery state and continuing the operation. LTSSM in the recovery state can start a speed or width degradation if errors are further detected during the retraining sequence.

Purpose

Ensure the reliability at the component level.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

PCIe link CRC error check and retry

Feature name

PCIe link CRC error check and retry

Description

This feature provides the ability of CRC error detection and transaction retry on error occurrence. The point is to protect the link from signal integrity issues caused by EMI, marginal links, poor connectors, long trace lengths, and so on. This feature provides a mechanism to detect and correct errors that can be corrected most of the time through retry.

Purpose

Improve the PCIe link reliability in case of low signal integrity.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

PCIe corrupt data containment (data poisoning)

Feature name

PCIe corrupt data containment (data poisoning)

Description

This feature attached an EP bit to the header any time the system detects an uncorrectable error before forwarding the packet to the next agent. This is used to achieve data integrity in both directions at the transaction level. The receiver detects the poison TLP and redirects the error event as a non-fatal warning (correctable error event) instead of sending it as an uncorrectable error signal, to avoid system reset.

Purpose

Improve the uptime and reliability of the system by allowing the system to continue operation when a poison mark is present on faulty data.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

PCIe ECRC

Feature name

PCIe ECRC

Description

When an uncorrected error is detected before a group is forwarded to the next proxy, the EP bit is appended to the header to maintain bidirectional data integrity at the transaction layer. The receiver detects TLPs with poison tags and redirects the error event as a non-fatal error (correctable error event) instead of sending it as an unrecoverable error signal, thus avoiding a system reset.

Purpose

Mark data as poison when a fault occurs, allowing the system to continue running, increasing normal operation time and reliability.

Configuration

Disabled by default and can be enabled from the BIOS.

Remarks

N/A

 

PCIe enhanced downstream port containment (eDPC)

Feature name

PCIe enhanced downstream port containment (eDPC)

Description

Downstream Port Containment (DPC) allows data transmission to be stopped when an uncorrectable error is detected on the downstream port or on a device connected to the downstream port. This can avoid the propagation of potentially corrupted data and allow software to restore the data. eDPC is an enhancement to the DPC function, which adds support for the Root Port Programmable IO (RPPIO) error.

Purpose

Improve the system reliability.

Configuration

Disabled by default and can be enabled from the BIOS.

Remarks

Make sure the OS has the DPC processing capability for link recovery.

 

PCIe card surprise hot plug

Feature name

PCIe card surprise hot plug

Description

This feature complies with the PCI Express protocol and does not require the OOB SMBus mechanism for hot removal and insertion.

Purpose

Remove or install a PCIe module during the system operation.

Configuration

Disabled by default and can be enabled from the BIOS.

Remarks

·     Proper software operations are required for the unexpected removal.

·     For information about support for PCIe slots, see the product manual.

 

PCIe card hot-plug (add/remove/swap)

Feature name

PCIe card hot-plug (add/remove/swap)

Description

This feature complies with the PCI Express protocol and requires the OOB SMBus mechanism for hot removal and insertion.

Purpose

Remove or install a PCIe module during the system operation.

Configuration

Disabled by default and can be enabled from the BIOS.

Remarks

·     Proper software operations are required for the unexpected removal.

·     For information about support for PCIe slots, see the product manual.

 

Error reporting via IOMCA

Feature name

Error reporting via IOMCA

Description

This feature allows IIO uncorrectable fatal and non-fatal errors to send error signals through MCE to improve the platform's diagnostic capabilities. If this feature is not available, all the IIO uncorrectable errors are reported through NMI or platform-specific error handlers that use SMI or ERROR_N[2:1] pins.

Purpose

Provide a uniform error reporting mechanism aligned with MCA for uncorrectable error signaling without relying on NMI.

Configuration

Disabled by default and configurable from the BIOS.

Remarks

N/A

 

Integrated error handler

Feature name

Integrated error handler

Description

This feature provides unified error reporting, which can collect error information from all internal and external PCIe devices under PCH and IIO. The error information is transmitted to the global IEH device through an internal message bus, and eventually generates related interrupts or external signals to notify BIOS or HDM for error processing.

Purpose

Provide the unified error reporting mechanism for PCIe devices.

Configuration

Disabled by default and not configurable.

Remarks

N/A

 

Faulty DIMM isolation

Feature name

Faulty DIMM isolation

Description

Faulty DIMM isolation is one of the fault management features of the servers using Intel Xeon processors. The platform can keep track of the number of correctable errors, carry out failure prediction analysis and scheduled services, and replace faulty components before the severity of the errors becomes uncorrectable. The platform system management will identify the root cause of the DIMM failure, map the faulty device, and schedule a repair.

Purpose

Improve the server availability and maintainability.

Configuration

Enabled by default.

Remarks

N/A

 

Out-of-band error log obtaining

Feature name

Out-of-band error log obtaining

Description

This feature is an HDM-based RAS implementation. It uses a PECI interface to access MCA bank registers to obtain memory error logs, UPI error logs, and IIO AER logs.

Purpose

Improve the monitoring ability of HDM fault management system.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Error injection

Feature name

Error injection

Description

You can configure error ejection settings from the BIOS. After enabled, this feature tests the system performance by error injection.

Purpose

Improve the system reliability by providing the ability to verify RAS features.

Configuration

Disabled by default and can be enabled.

Remarks

N/A

 

Predictive failure analysis

Feature name

Predictive failure analysis

Description

This feature enables predictive analysis on various correctable error logs and trends to identify potential risks and suggest appropriate measures. It can be applied to different subsystems.

Purpose

Enhance system stability, and predict potential risks and take corresponding measures.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Suppress inbound shutdown

Feature name

Suppress inbound shutdown

Description

This feature allows HDM to control system reboot for error log collection, ensuring successful retrieval of error logs without any failures caused by in-band system restart.

Purpose

Improve the monitoring ability of HDM fault management system.

Configuration

Enabled by default and configurable from the BIOS.

Remarks

N/A

 

Demoted warm reset

Feature name

Demoted warm reset

Description

In some cases, global reset is downgraded to warm reset for the BIOS to collect error information after reboot. When the system encounters a catastrophic error and the error information cannot be collected through OOB, use this feature to collect some sticky registers after the system warm reset. These error messages can be used as an important reference for error location.

Purpose

Improve the system maintainability.

Configuration

Enabled by default and not configurable.

Remarks

N/A

 

MCA 2.0 recovery

Feature name

MCA 2.0 recovery (as per EMCA gen2 architecture)

Description

EMCA gen2 allows firmware to intercept errors (correctable and uncorrectable errors) triggered by MCA and enables FFM of error handling and possible recovery.

Purpose

Recover the system from uncorrectable errors defined by the EMCA Gen2 specification through the software layers.

Configuration

Disabled by default and configurable.

Remarks

N/A

 

 

 

 

MCA recovery – execution path

Feature name

MCA recovery – execution path

Description

This feature assists the server to recover from uncorrectable errors through the software layers. The software layers including OS, VMM, DBMS, and applications, can assist the system to recover from uncorrectable errors at the hardware level, and mark the errors as corrupt data through the processors.

If a processor identifies an error that cannot be corrected by hardware, the processor marks the data as corrupt data and hands the error event firmware and/or the OS. If the firmware or operating system has a redundant copy of the data, the error might be corrected. If the error occurs in the application space, the operating system can use the SIGBUS event to signal the application and allow further recovery or termination of the application and keep the operating system running. If the error occurs in the kernel space, the operating system will trigger a kernel panic.

Purpose

Recover the system from uncorrectable errors through the software layers.

Configuration

Enabled by default and cannot be disabled.

Remarks

OSs recommended: WS 2008 or higher, REHL 6 or higher, and SUSE 11 or higher.

 

MCA recovery – non-execution path

Feature name

MCA recovery – non-execution path

Description

For some uncorrectable errors on non-execution paths, the OS can recover or isolate faulty data. The non-execution paths include patrol scrub events or LLC explicit write back transaction processing.

If a processor identifies an error that cannot be corrected by hardware, the processor marks the data as corrupted data and hands the error to firmware and/or the OS. The OS isolates the affected page and prevents applications from using it. This allows the system to continue to operate correctly. If the error occurs in the kernel space, the OS might not be able to isolate the faulty page and can only log the error and continue normal operation.

Purpose

Improve the system availability through the software layers.

Configuration

Enabled by default and cannot be disabled.

Remarks

OSs recommended: WS 2008 or higher, REHL 6 or higher, and SUSE 11 or higher.

 

Local machine check exceptions (LMCE) based recovery

Feature name

Local machine check exceptions (LMCE) based recovery

Description

LMCE allows the system to deliver the SRAR-type UCR events to the affected logical processors receiving poison data. LMCE implements following functions:

·     Enumeration—Identifies the hardware that supports LMCE through software.

·     Control mechanism—UEFI has the ability to enable or disable LMCE. This requires the software to enter LMCE.

·     Identification of LMCE—The software can identify whether the delivered MCE is only for one logical processor on MCE delivery.

Purpose

Prevent software from broadcasting SRAR-type UCR errors to all threads.

Configuration

Disabled by default and configurable.

Remarks

Corrupt data containment – Uncore must be enabled.

 

Viral mode

Feature name

Viral mode

Description

The viral mode is an advanced fault-tolerant feature designed for fatal errors. It is used to prevent faults from spreading to non-volatile storage devices or network devices. Errors that can cause the processor to enter the viral mode are all uncorrectable errors.

Purpose

Control the spread of errors.

Configuration

Enabled by default and configurable from the BIOS.

Remarks

Enable the poison mode first.

 

Asynchronous MCA error injection (aka MCA bank spoofing error injection)

Feature name

Asynchronous MCA error injection (aka MCA bank spoofing error injection)

Description

This feature allows the OS or BIOS to simulate error occurrence by writing to the MCA Bank registers.

Purpose

Provide the capability to verify RAS features, ensuring system reliability.

Configuration

Disabled by default and configurable from the BIOS.

Remarks

N/A

 

Hot swappable power supplies in N+N redundancy

Feature name

Hot swappable power supplies in N+N redundancy

Description

The power supplies can be hot swapped at the server rear.

Purpose

Ensure the reliability of the power system.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Hot swappable fan modules in N+1 redundancy

Feature name

Hot swappable fan modules in N+1 redundancy

Description

The fan modules support N+1 redundancy. The server can operate correctly when a single fan fails. You can hot swap a fan module.

Purpose

Ensure the reliability of the server heat dissipation system.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Hot swappable OCP network adapters

Feature name

Hot swappable OCP network adapters

Description

This feature provides the support of an OCP slot. You can hot insert or remove an OCP network adapter directly from the device back panel.

Purpose

Ensure that the OCP network adapter can be hot swappable.

Configuration

Enabled by default and cannot be disabled.

Remarks

You must use OCP network adapters and operating systems specified in H3C compatibility matrixes..

 

Hot swappable drives and RAID controllers

Feature name

Hot swappable drives and RAID controllers

Description

RAID levels 0, 1, 1 ADM, 10, 10 ADM, 1E, 5, 50, and 60 are supported. The drives are hot swappable.

Purpose

Ensure the availability of the storage system.

Configuration

RAID arrays require scheduled configuration

Remarks

Support for RAID levels varies by RAID controller configuration.

 

Drive fault location

Feature name

Drive fault location

Description

The server supports locating a single drive fault.

Purpose

Quickly locate drive faults.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Power fail safeguard

Feature name

Power fail safeguard

Description

When a system power failure occurs, the supercapacitor of a power fail safeguard module can provide power for a short period of time for data to be transferred from the DDR memory to the flash card. When the power recovers, the data can be transferred back to drives.

Purpose

Prevents data loss caused by unexpected power failure.

Configuration

Enabled by default and cannot be disabled.

Remarks

Because of RAM battery capacity limit, the data can be protected for hours or tens of hours. The actual time depends on the supercapacitor model.

 

Drive fault monitoring and data recovery

Feature name

Drive fault monitoring and recovery

Description

This feature enables the system to inform users of physical drive or logical drive faults through in-band or out-of-band (SEL log reporting) channels.

In a scenario where RAID is configured on the server, the feature can use RAID array features to recover data in failed drives.

Purpose

Enables fast fault identification to prevent error expansion and helps data recovery through RAID.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

RAID controller fault location

Feature name

RAID controller fault location

Description

RAID controller faults can be displayed in many ways. For example, overtemperature errors can be reported by sensors and RAID controller operation events can be logged as log messages.

Purpose

Simplifies monitoring of RAID controller status and identifies RAID controller faults to accelerate troubleshooting.

Configuration

Enabled by default and cannot be disabled.

Remarks

This feature is only supported by LSI RAID controllers except the LSI 9300, 9311, and 9400 RAID controllers.

 

Dual out-of-band management software images

Feature name

Dual out-of-band management software images

Description

If the one image fails, HDM can start up by using the other image.

Purpose

Ensure the availability of HDM.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Centralized fault management system

Feature name

Centralized fault management system

Description

The fault management system comprehensively monitors the server, provides a reliable fault detection and prediction mechanism, and offers multi-dimensional alerts for users through HDM. The following faults can be detected:

·     Processor hardware failure, including CAT errors, self-check failure, and configuration errors.

·     Overtemperature alarms, including alarms at air inlet and outlet, processors, memory, power supplies, and drives.

·     Voltage faults on the server boards.

·     Fan module faults.

·     Power source faults, including power supply input lost (AC/DC), overtemperature conditions, and power supply fan failure.

·     DDR3 and DDR4 DIMM faults, including correctable ECC errors exceeding threshold, overtemperature conditions, and configuration errors.

·     Storage system faults, including LSI storage controller errors, SAS/SATA drive faults, and logical drive exception.

·     System shutdown.

·     Hardware operation status (via system health LED).

·     Faulty components (via SEL log messages)

·     HDM and OS reboot errors (via SEL log messages).

Purpose

Provide a unified fault management.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Location of faulty processors

Feature name

Location of faulty processors

Description

Review the SEL log from HDM and report the location of a faulty processor.

Purpose

Quickly locate a faulty processor.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Location of faulty DIMMs

Feature name

Location of faulty processors

Description

Review the SEL log for the location of a faulty DIMM from HDM.

Purpose

Precisely locate a faulty DIMM.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Location of faulty PCIe devices

Feature name

Location of faulty PCIe devices

Description

Review the SEL log for the location of a faulty PCIe device from HDM.

Purpose

Precisely locate a faulty PCIe device.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Location of faulty power supplies

Feature name

Location of faulty power supplies

Description

Review the SEL log for the location of a faulty power supply from HDM or use power supply LEDs to identify the faulty power supply.

Purpose

Quickly locate a faulty power supply.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Location of faulty fan modules

Feature name

Location of faulty fan modules

Description

Review the SEL log for the location of a faulty fan module from HDM.

Purpose

Quickly locate a faulty fan module.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

System board monitoring and environment information from HDM

Feature name

System board monitoring and environment information from HDM

Description

HDM monitors the voltage, current, temperature, and power of key components in real time and provides corresponding graphics. Data are recorded by period.

Purpose

HDM monitors the voltage, current, temperature, and power of key components in real time and provides corresponding graphics.

Configuration

Enabled by default and cannot be disabled.

Remarks

N/A

 

Remote update of system software and firmware from HDM

Feature name

Remote update of system software and firmware from HDM

Description

HDM supports remote maintenance and update of the system software and firmware

Purpose

Improve the maintainability.

Configuration

Enabled by default and cannot be disabled. You can update the software and firmware from HDM.

Remarks

N/A

 

BSoD screenshots

Feature name

BSoD screenshots

Description

This feature automatically takes a bluescreen of death (BSoD) screenshot upon a system crash of Windows for future troubleshooting. HDM can save a maximum of 10 BSoD screenshots, which are named with a sequence number and the screenshot time. When the maximum number of screenshots is reached, a new BSoD screenshot overwrites the oldest one.

Purpose

View snapshots upon shutdown to help locate faults when a system shutdown occurs.

Configuration

Enabled by default and can be disabled from HDM.

Remarks

·     Make sure the KVM service has been enabled.

·     HDM can save a maximum of 10 BSoD screenshots

 

Video replay

Feature name

Video replay

Description

This feature records the server status upon occurrence of severe operating system events, including crash, restart, and shutdown. You can replay these videos to analyze or troubleshoot the recorded events.

Purpose

Help locate faults by viewing videos from HDM.

Configuration

Enabled by default and can be disabled from HDM.

Remarks

·     Make sure the KVM service has been enabled.

·     If the remote console is open when an event triggers video recording, video recording will fail.

·     Crash event recording is available only for the Windows operating system.

·     If the operating system is in sleep state when an event occurs, the video replay displays no signal.

 

Log download

Feature name

Log download

Description

This feature enables users to download SDS logs during runtime, including operation logs, event logs, component logs, static logs, and HDM system logs. You can use UniSystem to parse event logs and storage logs to learn about the server operation status. You can download the log entries for a period or download the entire log to an .sds log file.

SDS log messages record context for every error, provide simple recommended actions, and allow message obtaining through multiple in-band or out-of-band methods. Information is provided in plaintext and is easy to use.

Purpose

Improve the serviceability by providing fault location ability through faulty data collection, fault analysis, and fault diagnosis.

Configuration

Enabled by default and can be downloaded from HDM.

Remarks

You cannot view the logs from HDM. To view the log entries, download the log entries to an .sds log file and import the .sds log file to UniSystem.


Appendix A Glossary

Word/Acronym

Definition

ADDDC

Adaptive Double Device Data Correction

AER

Advanced Error Reporting

BIOS

Basic Input Output System

BIST

Built in Self-Test

CDC

Corrupt Data Containment, also known as Data Poisoning

Core

A portion of a processor containing the processing units such as Execution Engine (EE) and the dedicated caches

CHA

Cache and Home Agent

CMCI

Corrected Machine Check Interrupt

CRC

Cyclic Redundancy Check

CXL

Compute Express Link™, an open interconnect protocol between CPUs and the accelerator.

DCU

Data Cache Unit, a L1 cache

DMI

Direct Media Interface, proprietary data path between Intel CPU and PCH

DIMM

Dual-Inline-Memory-Module, a memory device on a socketable substrate

ECC

Error Checking and Correcting

EDPC

Enhanced Downstream Port Containment

EMCA

Enhanced Machine Check Architecture

FFM

Firmware First Model

FW

Firmware

FRB

Fault Resilient Boot

HBM

High Bandwidth Memory

HDM

H3C Device Management, IPMI-compliant module-level management controller developed by H3C

HW

Hardware

ICU

Instruction Cache Unit

IEH

Integrated Error Handler

IFU

Instruction Fetch Unit

IIO

Integrated I/O Module

IMC

Integrated Memory Controller

LLC

Last Level Cache (L3 cache)

LPC

Low Pin Count, used to connect to I/O devices

MCA

Machine Check Architecture

MCC

Medium Core Count

MCE

Machine-Check Exception

MDF

Modular Die Fabric

MLC

Mid Level Cache

MRC

Memory Reference Code

OS

Operating system

PCH

Platform Controller Hub

PCIe

Peripheral Component Interconnect Express

PCLS

Partial Cache Line Sparing

PCU

Power Control Unit

POST

Power On Self Test

RAS

Reliability, availability, serviceability

Runtime

OS runtime

SDDC

Single device data correction (DIMM CRC)

SMI

System Management Interrupt

TLP

PCI Express Transaction Layer Packet

UEFI

Unified Extensible Firmware Interface

Uncore

Functionality in processor socket other than processor cores.

It encompasses CHA, M2M, Intel®UPI, IMC, IVR, PCU, and UBOX. Note that IIO module is considered as outside of the Uncore but it is still integrated in the same die.

UPI

Ultra Path Interconnect

VT-d

Intel Virtualization Technology For Directed I/O

XCC

Extreme Core Count

 

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