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H3C IT RACK Series Product Information for Ecodesign Requirements of (EU) 2019/424
Regulatory Reference: COMMISSION REGULATION (EU) 2019/424, implementing Directive 2009/125/EC of the European Parliament and of the Council with regard to Ecodesign requirements for servers and online data storage products.
|
Product Type |
Sever |
|
Manufacturer |
New H3C Technologies Co., Ltd |
|
Trade |
H3C |
|
Address |
466 Changhe Road, Binjiang, 310052 Hangzhou, PEOPLE'S REPUBLIC OF CHINA |
|
Product Model |
H3C UniServer R4900 G5 |
|
Year of Manufacture |
2019 |
PSU Efficiency
|
PSU model |
PSR850-12A |
|||
|
Rated Output |
+12V/70.8A,+12VSB/2.1A |
|||
|
Rated Load |
10% |
20% |
50% |
100% |
|
PSU Efficiency |
91．99% |
95.25% |
96.13% |
94.4% |
|
Power Factor |
- |
- |
0.99 |
- |
|
PSU model |
CRPS1600C2 |
|||
|
Rated Output |
+12.2V/132A,+12VSB/3.0A |
|||
|
Rated Load |
10% |
20% |
50% |
100% |
|
PSU Efficiency |
92.53% |
95.65% |
96.16% |
93.89% |
|
Power Factor |
- |
- |
0.99 |
- |
Note1: DC-DC internal power supplies don’t need to fill in the form.
Note2: External Power Supplies (EPS) are regulated as a separate component in the European Union and a separate compliance document is required for EPSs. Leave Internal Power Supply test data fields blank for products that use an EPS (and that do not use an internal power supply).
Idle State Power (W) and Active state efficiency
The test for Idle State power and Active State Efficiency is based on ETSI EN 303 470 V1.1.1 (2019-03)- Environmental Engineering (EE); Energy Efficiency measurement methodology and metrics for servers.
|
Configuration |
Idle State Power (W) |
Active state efficiency |
|
Low-end performance configuration |
519.52 |
302.6 |
|
High-end performance configuration |
532.32 |
312.1 |
Note: SERT Active State Efficiency must be higher to pass to table 5 of the Regulation. SERT Idle State Power must be lower than the calculated limit to pass- described in Annex II 2.1 of the Regulation.
Components List for additional idle power allowances
|
System characteristics |
Quantity |
Additional Idle Power Allowances |
|
CPU Performance |
2 |
15.4 |
|
Additional PSU |
0 |
0 |
|
HDD or SSD |
3 |
15 |
|
Additional Memory (GB) |
2044 |
367.92 |
|
Additional buffered DDR Channel |
24 |
96 |
|
Additional I/O devices |
0 |
0 |
|
Total additional idle power allowances |
/ |
494.32 |
Maximum Power (W)
|
Configuration |
Maximum Power |
|
Low-end performance configuration |
519.52 |
|
High-end performance configuration |
532.32 |
Operating Condition Class
|
|
Dry bulb temp °C |
Humidity range, non-condensing |
|
|
||
|
Operating Condition Class |
Allowable Range |
Recommended Range |
Allowable Range |
Recommended Range |
Max Dew Point (°C) |
Maximum rate of Change (°C/hr) |
|
A4 |
5-45 |
18-27 |
-12 °C DP and 8 % RH to 24 °C DP and 90 % RH |
-9 °C DP to 15 °C DP and 60 % RH |
24 |
5/20 |
Idle State Power at the higher boundary temperature of the declared operating condition class
|
Configuration |
Idle State Power |
|
Low-end performance configuration |
519.52 |
|
High-end performance configuration |
532.32 |
List of all model configurations
|
Computing |
2×3rd generation Intel® Xeon® Scalable processors (Up to 40 cores and maximum 270 W power consumption) |
|
Memory |
32 × DDR4 DIMMs, 12.0 TB (maximum) (Up to 3200 MT/s data transfer rate and support for both RDIMM and LRDIMM) (Up to 16 Intel ® Optane™ DC Persistent Memory Module PMem 200 series .( Barlow Pass) |
|
Storage |
Support up to Front 12LFF bays, Internal 4LFF bays , Rear 4LFF+4SFF bays Support up to Front 25SFF bays, Internal 8SFF bays , Rear 4LFF+4SFF bays Support Front/Internal SAS/SATA HDD/SSD/NVMe Drives Maximum 28 x U.2 NVMe Drives PCIe NVMe storage accelerator, SATA/PCIe M.2 SSDs, 2 × SD Internal slots (Optional) |
|
GPU |
14 × single-slot wide or 4 × double-slot GPU modules |
Note: The configurations of server product family are end-user configurable / selectable, the detail can be found at http://www.h3c.com
The Concentration of Cobalt and Neodymium
|
Item |
Description |
|
Cobalt in battery |
Less than 5g |
|
Neodymium in HDD |
between 5 g and 25 g |
Disassembly Operations
|
Operation Type |
Description |
|
|
Data Storage Device |
Release buckle |
|
|
Memory |
Release buckle |
|
|
CPU |
Remove Screw |
|
|
Motherboard |
Release buckle |
|
|
Expansion/Graphic Card |
Release buckle |
|
|
PSU |
Release buckle |
|
|
Chassis |
Release buckle |
|
|
Batteries |
Release buckle |
|
|
Fastening technique type |
Quantity |
Required Tool |
|
Trox Screw |
24 |
Trox Screw Driver T15 |
|
Trox Screw |
8 |
Trox Screw Driver T10 |
|
Trox Screw |
4 |
Trox Screw Driver T30 |
|
Philps Screw |
2 |
Philps Screw Driver #2 |
|
Buckle |
76 |
/ |
