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H3C UniServer R6900 G5 Server

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R6900 G5 Front
4U G5 SFF
R6900 G5 rear

Highlights:High Performance High Reliability, High Scalability

New generation H3C UniServer R6900 G5 adopt a modular architecture to provide outstanding scalable capacity supporting up to 50 SFF drives include optional 24 NVMe SSD drives.

R6900 G5 server features Enterprisegrade RAS make it a decent choice for core workload, virtualization Database, dataprocessing and highdensity computing application.

H3C UniServer R6900 G5 utilizes the most recent 3rd Gen Intel®Xeon® Scalable processors. (Cedar Island),6 UPI Bus interconnection and DDR4 memory with 3200MT/s speed as well as Newgeneration PMem 200 series persistent memory to strongly lift the performance up to 40% compared with previous platform. With 18 x PCIe3.0 I/O slots to reach excellent IO scalability.

94%/96% power efficiency and 5~45℃ operating temperature provide users a TCO returns in a greener data center.

R6900 G5 is optimized for environments:

Virtualization — Support multiple types of core workloads on a single server to simplify Infrainvestment.

Big Data — Manage exponential growth of structured, unstructured, and semistructured data.

Data warehouse/analysis — Query data on demand to help service decision

Customer relationship management (CRM) — Help you to gain comprehensive insights into business data to improve customer satisfaction and loyalty

Enterprise resource planning (ERP) — Trust the R6900 G5 to help you manage services in real time

Highperformance computing and deep learning — Provide sufficient GPUs to support machine learning and AI applications

The R6900 G5 supports Microsoft® Windows® and Linux operating systems, as well as VMware and H3C CAS and can operate perfectly in heterogeneous IT environments.

Industrial-leading performance improves data center productivity

4 sockets of the 3rd Gen Intel®Xeon®Scalable

Processors

9 x single-slot wide GPU modules or 3 x double-slot wide GPU

24 x Intel ® Optane™ DC Persistent Memory Module(PMem 200)

Favorable Scalability and flexibility

Modular Design

Flexible 50 sff Drives

24 x NVME+M.2+MicroSD

18 x full height PCI-E 3.0 Slots+1 OCP3.0 slot

Enterprise-grade RAS

High RAS features

Redundant Components

Effective Security Design

TPM/TCM

Chassis Intrusion Detection

Silicon Root of Trust

CPU

4 x 3rd generation Intel® Xeon® Cooper Lake SP series

Each processor up to 28 cores and maximum 250W power consumption)

Chipset

Intel® C621A

Memory

48 × DDR4 DIMM slots , maximum 12.0 TB*

Up to 3200 MT/s data transfer rate and support for both RDIMM and LRDIMM

Up to 24 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass)

Storage controller

Embedded RAID controller (SATA RAID 0, 1, 5, and 10)

Standard PCIe HBA cards and storage controllers, depending on model

FBWC

8 GB DDR4 cache, depending on model , support supercapacitor protection

Storage

Maximum Front 50SFF, Support SAS/SATA HDD/SSD Drives

Maximum 24 front U.2 NVMe Drives

SATA M.2 SSDs/2 × SD cards , depending on model

Network

1 × onboard 1 Gbps management network port

OCP 3.0 × 16 open slot to install 4 × 1GE copper ports/2 × 10GE/2 x 25GE fiber ports

Standard PCIe 3.0 Ethernet Adapters

PCIe Standard slots for 1/10/25/40/100GE/IB Ethernet Adapter,

PCIe slots

18 × PCIe 3.0 FH standard slots

Ports

VGA connectors (Front and Rear) and serial port(RJ-45)

6 × USB 3.0 connectors (2 front, 2 rear, 2 internal)

1 dedicated management connector

GPU

9 × single-slot wide or 3 × double-slot wide GPU modules

Optical drive

External optical disk drive , Optional

Management

HDM (with dedicated management port) and H3C FIST, support LCD touchable smart model

Security

Intelligent Front Security Bezel *

Support Chassis Intrusion Detection

TPM2.0

Silicon Root of Trust

Two-factor authorization logging

Power supply

Support 4 × Platinum 1600W*(supports 1+1/2+2 redundancy) ,

800W –48V DC power supplies (1+1/2+2 redundancy)

8 × Hot swappable fans

Standards

CE,UL , FCC,VCCI,EAC, etc.

Operating temperature

5°C to 45°C (41°F to 113°F)

The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.

Dimensions (H × W × D)

4U Height

Without a security bezel: 174.8 × 447 × 799 mm (6.88 × 17.59 × 31.46 in)

With a security bezel: 174.8 × 447 × 830 mm (6.88 × 17.59 × 32.67 in)

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